Design steps of PCB design-Company news -Shenzhen ZhiXinQiang Technology Co., Ltd.

Design steps of PCB design

2020-12-25(319)Views

In the PCB, special components refer to the key components of the high-frequency part, the core components in the circuit, the components that are susceptible to interference, the components with high voltage, the components with high heat generation, and some components of the opposite sex. The locations of these special components needs to be carefully analyzed, and the belt layout meets the requirements of circuit functions and production requirements. Improper placement of them may cause circuit compatibility issues, signal integrity issues, and lead to failure of PCB design.

When placing special components in the design, first consider the PCB size. Quick and easy shopping pointed out that when the PCB size is too large, the printed lines will be long, the impedance will increase, the anti-drying ability will decrease, and the cost will increase; if the size is too small, the heat dissipation will not be good, and the adjacent lines will be easily disturbed. After determining the size of the PCB, determine the swing position of the special component. Finally, according to the functional units, layout all the components of the circuit. The locations of special components should generally follow the following principles during layout:

1. Shorten the connections between high-frequency components as much as possible, and try to reduce their distribution parameters and mutual electromagnetic interference. Components that are susceptible to interference should not be too close to each other, and the input and output should be as far away as possible.

2. Some components or wires may have a higher potential difference. The distance between them should be increased to avoid accidental short circuits caused by discharge. High-voltage components should be placed out of reach as far as possible.

3. Components weighing more than 15G can be fixed with brackets and then welded. Those heavy and hot components should not be placed on the circuit board, but should be placed on the bottom plate of the main box, and heat dissipation should be considered. Thermal components should be far away from heating components.

4. The layout of adjustable components such as potentiometers, adjustable inductance coils, variable capacitors, micro switches, etc. should consider the structural requirements of the entire board. Some frequently used switches should be used if the structure permits. Place it where your hands can easily reach. The layout of the components should be balanced, dense, and not top-heavy.

The success of a product is to focus on internal quality. The second is to take into account the overall beauty, both of which are more perfect boards, can become a successful product.

1. Place components that closely match the structure, such as power sockets, indicator lights, switches, connectors, etc.
2, place special components, such as large components, heavy components, heating components, transformers, ICs, etc.

3. Place small components.

Layout check
1. Whether the size of the circuit board and the processing size required by the drawing are consistent.
2. Is the layout of the components balanced, neatly arranged, and whether they have all been laid out.
3. Whether there are conflicts at all levels. For example, whether the components, outer frame, and the level of silk screen are reasonable.
4. Whether the commonly used components are convenient to use. Such as switches, plug-in board insertion equipment, components that must be replaced frequently, etc.
5. Is the distance between thermal components and heating components reasonable?
6. Whether the heat dissipation is good.
7. Whether the line interference problem needs to be considered.

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