Chip packaging and testing: mature areas in the local semiconductor industry chain-Company news -Shenzhen ZhiXinQiang Technology Co., Ltd.

Chip packaging and testing: mature areas in the local semiconductor industry chain

2020-12-25(458)Views

It is reported that Huawei and ZTE are intentionally moving their supply chains to the mainland. At present, 5G base station chips have begun packaging and testing in the mainland, but they are still in the engineering approval stage. After the packaging plant is packaged, the products are directly shipped back, and Huawei HiSilicon or ZTE does its own internal testing work and manages the test data, and the real mass production should go to the third quarter. At this stage, several large packaging and testing manufacturers are actively seizing orders.

Taiwan media recently reported that ASE, the world’s leading semiconductor packaging and testing company, has entered ZTE’s supply chain with its 2.5D/interposer technology-based advanced packaging and testing process, and has won a large order for the mass production of ZTE’s independent development of 5G base station chips. It is reported that ASE Investment and Control Panel-level Fan-Out Package (FOPLP) has obtained a packaging and testing order from Huawei HiSilicon in the first half of 2019.

Since the second half of 2019, a new round of semiconductor boom has basically been established and kicked off globally. For mainland IC practitioners, the logic of Huawei's order transfer and industrial transfer will further strengthen the current economic cycle and make its interpretation in mainland China more vivid. As a mature field in the local semiconductor industry chain, the packaging and testing link has more certainty in its order acceptance capabilities.

At the same time, the chip has brought a revolutionary improvement to AAU, achieving a size reduction of over 50%, a weight reduction of 23%, and a power consumption reduction of 21%. The installation time is half the time compared with a standard 4G base station, effectively solving site acquisition Challenges such as difficulty and high cost.

Insiders said that 5G base station chips mainly use BGA packaging technology, and technical issues such as packaging speed, performance, and stability determine how many orders each company can get.

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